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Hardware Industrial Zone, Southern China international industrial city, Pinghu
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High-power LED light emitting diode package silico

This series of packaging materials for the LED silicone is mainly used for light-emitting diode (LED) package,
With a high refractive index and high transmittance, can increase the luminous flux of LED, low viscosity, easy deaeration for potting and molding, the LED has good durability and reliability.
This series of products for the two-component liquid of high refractive index silicone encapsulants. Sealing electronic components used to strengthen the integrity of electronic devices to improve the external shocks, vibration resistance, improve internal components, the line between the insulation will help the device smaller and lighter, to avoid components, direct line exposed to the environment, improve the device waterproof, moisture resistant.
Features: high transmittance, high refractive index, curing speed, good fluidity, heat resistance, weather resistance is good;
Typical applications: high power LED light emitting diode package (lens fill), high power LED package module top molding, TOP SMD LED packaging, LED phosphor transfer adhesive, encapsulation of solar panels and other products.
Specifications: High-power LED light emitting diode package silicone series
Model G3818 G3410 G3360 G3330 G3370 G3150 G3235 G3265
Transparency characteristics
Extremely high refractive index, low-temperature fast-curing,
High degree of transparency transparency
, And the PPA
Strong transparent adhesive can be cured at room temperature hardness, strong adhesion with the PPA's high refractive index, transparency, high refractive index, high transparency, high refractive index, high transparency
Color colorless colorless colorless colorless colorless colorless colorless colorless
Application

Fill the field of high-power, high power SMD package for filling, the top model for high power SMD package
molding casting, plastic phosphors are also suitable for high-power fill, especially for large packages, free baking for SMD package, the power module power module roof top package molding molding casting, also suitable for fluorescent plastic suitable for plastic phosphor, high-power high-power mode top model top molding molding potting potting, adhesive is also suitable for fluorescent
Mixed 1:1 1:1 1:1 1:1 1:1 1:1 1:1 1:1
Mixed viscosity
(MPa.s) 1000-1500 1000-1500 2500
800-1500
3,000,500,070,003,500
Curing condition 100 ℃ / 1h 100 ℃ / 2h 110 ℃
/ 1h +150 ℃
/ 3h at room temperature / 3h + room / 9h; or 80 ℃ / 1h 110 ℃
/ 1h +150 ℃
/ 3h 100 ℃
/ 1h +150 ℃
/ 3h 100 ℃
/ 1h +150 ℃
/ 3h 100 ℃
/ 1h +150 ℃
/ 3h
Hardness / / 55 Shore A 30-35
Shore A 65 Shore A 50 Shore A 40 Shore D 40 Shore D
Refractive index 1.41 1.53 1.41 1.41 1.41 1.53 1.53 1.53
Transmittance% 450nm, 1mm ≥ 95 ≥ 95 ≥ 95 ≥ 95 ≥ 95 ≥ 95 ≥ 95 ≥ 95
Reference Products OE-6450 - EG-6301 OE-6550 OE-6636 OE-6630




Use Guidelines:

1 using the ratio: the use of the table reference mixing ratio;
2 to A, B material was mixed evenly, put vacuum deaeration (to make the rubber compound removal of residual air clean, so as not to affect the air tightness).
3. A, B mixture after deaeration, the use of needles or dispensing filling, the filling is completed the curing process.
4 curing conditions: curing conditions refer to the table.
Storage conditions:
A, B agents at room temperature, closed containers in a cool dry place.
Shelf life:
Under these conditions, shelf life of 6 months shelf life after passing through the test can continue to use technical indicators.
Packing:
Component A: 1 Kg / barrel, 0.5 Kg / barrel; B components: 1 Kg / barrel, 0.5Kg / barrel.
Note:
Storage, use and process must ensure that no phosphorus (P), sulfur (S), nitrogen (N) and organic tin (Sn) compounds such contact.

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